QLAg1110 are nano-silver pastes designed for pressure sintering processes. It utilizes a self-developed paste formulation with excellent electrical and thermal conductivity and high shear strength. These pastes enable highly reliable sintered connections on gold, silver, and copper substrates, providing a high-reliability packaging solution for high-power devices.

QLCu2112 is a nano-copper paste suitable for pressure sintering processes. It utilizes a self-developed paste formulation with excellent antioxidant capacity. It can be used in vacuum, nitrogen, and formic acid atmospheres, providing a high-reliability packaging solution for high-power devices.

QLAg1207 is a nano-silver paste suitable for pressureless sintering processes. lt offers excellent electrical conductivity, thermal performance, and interface bonding strength. It enables highly reliable sintered connections in various atmospheres, including air and nitrogen, providing a pressureless sintering solution for high-frequency, high-power electronic devices.

QLDTF7021 is a copper foil with sintering film suitable on die top sintering. It offers excellent electrical conductivity, thermal performance, and high-reliability. It can achieve highly reliable sintering connections on gold, silver/copper sintering on the top of high-power devices.

QLAgF7110 is a nano-silver film for pressure-assisted sintering processes, which utilizes a film transfer technique for simple and highly efficient operation. The sintering joints exhibit excellent electrical and thermal conductivity as well as superior interfacial connection strength, making it suitable for die attachment sintering and large-area wafer bonding.

Qlsemi has developed silver/copper large-area sintering pastes and silver large-area sintering preforms specifically for interconnections between heatsinks and modules. These products enable sintering at conditions as low as 220°C and 7 MPa, offering customers highly reliable large-area sintering solutions for SIC/IGBT packaging applications.

QLSn4020 is a high-quality preformed tin-based solder preform produced through precision processing. It is particularly suitable for formic acid reflow or vacuum soldering processes, offering simple and efficient operation. The preform demonstrates excellent wetting performance and superior TC/TST resistance, making it suitable for large-area soldering between AMB and heatsinks.

QLC1104 Conductive Carbon Paste is a nano-carbon paste designed for flexible printing. It adopts independently developed carbon black particle dispersion technology and paste formulation, featuring excellent printability and adhesion. It can be printed on various substrates such as PI, PCB and paperboard, forming a uniform film and providing a highly reliable solution for flexible printing.

QLCu2210 is a nano-copper paste suitable for pressureless sintering processes. In addition to die attachment packaging, it is also suitable for filling PCB microvias. It can partially replace traditional s stacked and staggered plated microvias, supports high-density interconnect (HDI) designs, and delivers a more flexible and efficient solution for achieving any-layer interconnection in the PCB applications.

QLTR300 is an online thermal resistance testing device suitable for semiconductor devices and heat dissipation systems. It uses internationally leading transient temperature measurement technology and structural function method principles to achieve non-destructive testing of the thermal resistance of multilayer structures in semiconductor devices. It features fast measurement speed, high testing accuracy, nondestructive testing, and a wide range of measurement targets.