All core team members are graduates of Tsinghua University and renowned automobile enterprises. The team is among the world's earliest pioneers engaged in the development of nano silver and copper sintering technologies. Backed by nearly two decades of R&D experience in nano-metal interconnection technology, the company has independently developed a full range of nano silver sintering materials and packaging equipment. It is also one of the very few semiconductor enterprises at home and abroad that master complete sets of nano copper sintering solutions covering packaging materials, packaging equipment and related processes. Driven by continuous innovation, Qinglian Technology will keep creating value for clients.

As an incubated enterprise of multiple industrial giants, the company has obtained ISO9001, ISO14001, ISO45001, IATF16949 and QC080000 certifications. Its full-series nano silver packaging materials have achieved stable mass production, while nano copper packaging materials have completed vehicle installation tests for multiple models and realized bulk delivery in partial application scenarios. In addition, it has carried out strategic cooperation and product development with numerous leading enterprises at home and abroad, enabling its high-performance and high-reliability device packaging technology to leap from following peers to taking the lead in the industry.