The porosity of the sintered structure is as low as 7%~9%.
Applicable to Au, Ag, Cu surfaces. The shear strength can be greater than 60 MPa with Ag surface.
High electrical and thermal conductivity, longer lifespan, and higher reliability.
Supporting low pressure sintering process, the temperature can be as low as 230℃ and the pressure can be as low as 10 MPa.
Indicators | Performance | Remarks |
Metal content | >80% | According to TG results |
Particle size | ≤3 μm | |
Sintering temperature | 230-250 ℃ | |
Sintering pressure | 10-20MPa | |
Sintering time | 3-5 min | |
Halogen content | Zero halogen | |
Sintering atmosphere | Air, inert atmosphere | |
Sintered surface | Ag、Au、Cu | An inert atmosphere is recommended for bare Cu surfaces |
Working life | ≥8h | |
Storage condition | 2-10 ℃ | |
Shelf life | 6 months |
Model | Thermal Conductivity (W/mK) | Electrical Resistivity (mΩ.cm) | Coefficient of Thermal Expansion (ppm/K) | Shear Strength (MPa) |
QLAg1109/QLAg1110 | >200 | ≤0.01 | 19 | >60 |