QLDTF7021 Copper Foil with Sintering Film - Copper Foil with Sintering Film - 联系我们福布斯有限公司开户电话15012099998（福布斯）

Copper Foil with Sintering Film

QLDTF7021 is a copper foil with sintering film suitable on die top sintering. It offers excellent electrical conductivity, thermal performance, and high-reliability. It can achieve highly reliable sintering connections on gold, silver/copper sintering on the top of high-power devices.

QLDTF7021 Copper Foil with Sintering FilmAdvantages

Suitable for copper wire bonding on die top.

Perfect edge condition: No black edges or burrs on the copper foil.

Dense and uniform sintering structure.

High shear strength, with shear strength exceeding 60 MPa.

High thermal conductivity, with thermal conductivity over 200 W/mK.

Basic Parameters

Indicators	Performance	Remarks
size	customizable
Copper foil thickness	50-100μm (customizable)
Silver film thickness	50±2μm (customizable)
Copper foil purity	99.993%
Silver film solid content	> 99%
Dispensing or not	Optional/Dispensing diameter300-400μm (if selected)
Storage condition	Room temperature, nitrogen
Storage life	6 months