QLAgF7110 Silver Sintering Film - Silver Sintering Film - 联系我们福布斯有限公司开户电话15012099998（福布斯）

Silver Sintering Film

QLAgF7110 is a nano-silver film for pressure-assisted sintering processes, which utilizes a film transfer technique for simple and highly efficient operation. The sintering joints exhibit excellent electrical and thermal conductivity as well as superior interfacial connection strength, making it suitable for die attachment sintering and large-area wafer bonding.

QLAgF7110 Silver Sintering FilmAdvantages

Excellent transfer performance, no pre-cutting required, suitable for embedded package.

Uniform film thickness, suitable for large-area wafer bonding.

High shear strength, with shear strength exceeding 60 MPa.

High thermal conductivity, thermal conductivity > 200 W/mK.

Basic Parameters

Indicators	Performance	Remarks
Solid content	≥99%	According to TG results
Particle size	≤3 μm
Halogen content	Zero halogen
Operation technology	Transfer printing
Sintering temperature	230-250 ℃
Sintering pressure	10-20 MPa
Sintering atmosphere	Vacuum, inert atmosphere
Sintered surface	Ag, Au, Cu
Whether residue needs to be cleaned	No cleaning	There is no residue on the substrate surface
Storage condition	Room temperature, nitrogen atmosphere
Shelf life	6 months