Supports wafer, waffle pack, and reel loading with a compact footprint.

Placement accuracy ≤ ±10 μm.

UPH: 1200 pcs (based on 0.5s place time).

Universal module interface for quick assembly/disassembly and flexible configuration.

Electromechanically integrated modular design with configurable modules.

EtherCAT bus control for simple wiring and communication .

Built-in vision calibration with high motion repeatability and stability.

Compatible with wafers, bare dies, AMB, and other substrates.