Suitable for heatsink-to-module interconnections.
Outstanding printability and process compatibility.
Compatible with silver sintering equipment and the sintering condition can be low as 220°C 、7MPa.
High thermal conductivity (>200 W/mK)
High reliability: no delamination after 1000 cycles of TST.
Significantly reduction in thermal resistance and an improvement in the current-carrying capacity of devices.
QLSEMI
Advanced Electronic Packaging Laboratory
京ICP备2024075813号
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