Cn
Enhanced Sn Solder
QLSn4020 is a high-quality preformed tin-based solder preform produced through precision processing. It is particularly suitable for formic acid reflow or vacuum soldering processes, offering simple and efficient operation. The preform demonstrates excellent wetting performance and superior TC/TST resistance, making it suitable for large-area soldering between AMB and heatsinks.
QLSn4020 Enhanced Sn SolderAdvantages

High purity, low impurity content, uniform microstructure, and no segregation.

Suitable for large-area soldering between AMB and heatsinks.

Simple processing with low voiding after soldering.

Excellent resistance to TC and TST.

Outstanding crack propagation resistance and interfacial microstructure stability.

Basic Parameters
Indicators
Performance
 Test Method
AppearanceSilver-graySilver-gray
Melting Temperature215-220℃
Density7.4g/cm3
Hardness35VHN
Resistivity14 μΩ·cm
Wetting Angle35°
Surface Tension490260℃/N2
Tensile Strength86 MPaCylindrical tensile specimen (φ 5 mm), 1mm/min strain rate
 
Elongation17%
Coefficient of Thermal Expansion19.7*10-6/℃


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