QLCu2112 Copper Sintering Paste - Copper Sintering Paste - 联系我们福布斯有限公司开户电话15012099998（福布斯）

Copper Sintering Paste

QLCu2112 is a nano-copper paste suitable for pressure sintering processes. It utilizes a self-developed paste formulation with excellent antioxidant capacity. It can be used in vacuum, nitrogen, and formic acid atmospheres, providing a high-reliability packaging solution for high-power devices.

QLCu2112 Copper Sintering PasteAdvantages

The porosity of the sintered structure is as low as 7%~9%.

Applicable to Au, Ag, Cu surfaces. The shear strength can be greater than 60 MPa with Ag surface.

High electrical and thermal conductivity, longer lifespan, and higher reliability.

Basic Parameters

Indicators	Performance	Remarks
Metal content	>80%	According to TG results
Particle size	≤1000 nm
Sintering temperature	≥250 ℃
Sintering pressure	10-20 MPa
Sintering time	5min
Halogen content	Zero halogen
Sintering atmosphere	Vacuum, inert atmosphere, formic acid atmosphere
Sintered surface	Cu、Ag、Au
Working life	≥8h
Storage condition	≤-20 ℃
Shelf life	6 months

Product Performance

Model	Thermal Conductivity （W/mK）	Electrical Resistivity （mΩ.cm）	Coefficient of Thermal Expansion (ppm/K）	Shear Strength（MPa）
QLCu2112	>200	<0.015	17.2	>40