Company Overview
Founded in 2021, Qinglian Technology is a national high-tech enterprise committed to providing high-performance and high-reliability electronic packaging interconnection solutions. Headquartered in Beijing Economic and Technological Development Zone, it has material production base in Suzhou and equipment manufacturing base in Tianjin, equipped with thousands of square meters of ultra-clean production workshops. It has also built full-process packaging prototyping and testing laboratories in Beijing and Suzhou. The company mainly engages in high-performance packaging materials, packaging and testing equipment, process development and device reliability evaluation services.R&D Capabilities
All core staff are graduates of Tsinghua University and renowned automotive enterprises, forming one of the world's earliest teams researching nano silver and copper sintering technologies. Drawing on nearly two decades of R&D experience in nano-metal interconnection technology, we have independently developed a full range of nano silver sintering materials and packaging equipment. We are also among the few semiconductor enterprises worldwide that offer complete nano copper sintering solutions covering materials, equipment and processes. Driven by constant innovation, Qinglian Technology will keep delivering value to clients.Mass Production & Delivery
As an enterprise incubated by multiple industrial giants, our company has obtained ISO9001, ISO14001, ISO45001, IATF16949 and QC080000 certifications. The full range of nano-silver packaging materials has achieved stable mass production, while nano-copper packaging materials have completed installation tests on multiple vehicle models and realized bulk delivery in partial application scenarios. Furthermore, we have carried out strategic cooperation and product development with numerous leading enterprises at home and abroad, enabling our high-performance and high-reliability electronic packaging technology to shift from following others to taking the lead in the industry.
corporate visionLeading the global advancement of advanced electronic packaging interconnect technologies 
enterprise missionMake every connection trustworthy 
core valueIntegrity
operation philosophyCreate value through technology
QLSEMI
Advanced Electronic Packaging Laboratory
京ICP备2024075813号
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Company Overview
