Products
QLAg1109/QLAg1110 are nano-silver pastes designed for pressure sintering processes.It utilizes a self-developed paste formulation with excellent electrical and thermal conductivity and high shear strength.These pastes enable highly reliable sintered connections on gold,silver,and copper substrates,providing a high-reliability packaging solution for high-power devices.
QLCu2112 is a nano-copper paste suitable for pressure sintering processes.It utilizes a self-developed paste formulation with excellent antioxidant capacity.It can be used in vacuum,nitrogen,and for micacid atmospheres,providing a high-reliability packaging solution for high-power devices.
QLAg1207 is a nano-silver paste suitable for pressureless sintering processes.It offers excellent electrical conductivity,thermal performance,and interface bonding strength.It enables highly reliable sintered connections in various atmosphores,including air and nitrogen,providing a pressureles sintering solution for high-frequency,high power electronic devices.
QLDTF7021 is a copper foil with sintering film suitable on die top sintering.It offers excellent electrical conductivity,thermal performance,and high-reliability.It can achieve highly reliable sintering connections on gold,silver,and copper substrates with a sintering pressure as low as15 MPa,silver/copper sintering on the top of high-power devlces.
QLAgF7110 is a nano-silver film for pressure-assisted sintering processes,which utilizes a film transfer technique for simple and highly efficient operation.The sintering joints exhibit excellent electrical and thermal conductivity as well as superior interfacial connection strength,making it suitable for die attachment sintering and large-areawafer bonding.
Qlsemi has developed large-area silver/copper sintering pastes and silver sintering preforms specifically for interconnections between heatsinks and modules.These products enable sintering at conditions as low as 220℃ and 7 MPa,offering customers highly reliable large-area sintering solutions for advanced packaging applications.
QLSn4020 is a high-quality, preformed tin-based solder preform. It is particularly suitable for formic acid reflow or vacuum soldering processes, offering simple and highly efficient operation. It features excellent wetting properties, resistance to thermal cycling, and high-low temperature shock characteristics, making it ideal for large-area soldering between AMB substrates and heat sinks.
QLC1104 Conductive Carbon Paste is a nano-carbon paste designed for flexible printing. It adopts independently developed carbon black particle dispersion technology and paste formulation, featuring excellent printability and adhesion. It can be printed on various substrates such as PI, PCB and paperboard, forming a uniform film and providing a highly reliable solution for flexible printing.
QLCu2210 is a nano-copper paste suitable for pressureless sintering processes. It features excellent electrical and thermal conductivity as well as superior interfacial bonding strength. It enables highly reliable sintered connections in environments such as inert atmospheres, providing a pressureless sintering solution for high-frequency and power electronic devices.
