Qlsemi has developed large-area silver/copper sintering pastes and silver sintering preforms specifically for interconnections between heatsinks and modules.These products enable sintering at conditions as low as 220℃ and 7 MPa,offering customers highly reliable large-area sintering solutions for advanced packaging applications.
·Suitable for heatsink-to-module interconnections.
·Outstanding printability and process compatibility.
·Compatible with silver sintering equipment and the sintering condition can be low as 220℃ under 7MPa.
·High thermal conductivity (>160W/mK)
·High reliability:no delamination after 1000 cycles of TST.
·Significantly reduction in thermal resistance and an improvemen in the current-carrying capacity of devices.
