QLAg1109/QLAg1110 are nano-silver pastes designed for pressure sintering processes.It utilizes a self-developed paste formulation with excellent electrical and thermal conductivity and high shear strength.These pastes enable highly reliable sintered connections on gold,silver,and copper substrates,providing a high-reliability packaging solution for high-power devices.
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Indicators
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Performance
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Remarks
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Metalcontent
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>80%
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AccordingtoTGresults
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Particlesize
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≤3μm
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Sinteringtemperature
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230-250℃
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Sinteringpressure
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10-20MPa
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Sinteringtime
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3-5min
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Halogencontent
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Zerohalogen
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Sinteringatmosphere
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Air,inertatmosphere
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Sinteredsurface
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Ag、Au、Cu
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Aninertatmosphereisrecommended
forbareCusurfaces
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Workinglife
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≤8h
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Storagecondition
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2-10℃
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Shelflife
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6months
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Model
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ThermalConductivity
（W/mK）
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ElectricalResistivity
（mΩ.cm）
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Coefficientof
Thermal Expansion
（ppm/K）
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ShearStrength
（MPa）
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QLAg1109/QLAg1110
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>200
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≤0.01
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19
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>60
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·Applicable to Au,Ag,Cu surfaces.The shear strength can be greater than60 MPa with Ag surface.
·High electrical and thermal conductivity,longer lifespan,and higher reliability.
·Supporting low pressure sintering process,the temperature can be as low as 230℃ and the pressure can beaslow as 10MPa.
