QLAgF7110 is a nano-silver film for pressure-assisted sintering processes,which utilizes a film transfer technique for simple and highly efficient operation.The sintering joints exhibit excellent electrical and thermal conductivity as well as superior interfacial connection strength,making it suitable for die attachment sintering and large-areawafer bonding.
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Indicators
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Performance
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Remarks
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Solidcontent
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≥99%
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AccordingtoTGresults
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Particlesize
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≤3μm
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Halogencontent
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Zerohalogen
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Operationtechnology
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Transferprinting
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Sinteringtemperature
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230-250℃
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Sinteringpressure
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10-20MPa
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Sinteringatmosphere
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Vacuum,inertatmosphere
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Sinteredsurface
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Ag,Au,Cu
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Whetherresidueneedstobecleaned
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Nocleaning
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Thereisnoresidueonthesubstratesurface
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Storagecondition
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Roomtemperature,nitrogenatmosphere
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Shelflife
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6months
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·Simple operation,no need for printing,suitable for embedded package.
·Uniform film thickness,suitablefor large-area sintering.
·High shear strength,with shear strength exceeding 60 MPa.
·High thermal conductivity,thermal conductivity>200W/mK.
