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  • Enhanced Solder Preform

    QLSn4020 is a high-quality, preformed tin-based solder preform. It is particularly suitable for formic acid reflow or vacuum soldering processes, offering simple and highly efficient operation. It features excellent wetting properties, resistance to thermal cycling, and high-low temperature shock characteristics, making it ideal for large-area soldering between AMB substrates and heat sinks.

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