QLCu2210 is a nano-copper paste suitable for pressureless sintering processes. It features excellent electrical and thermal conductivity as well as superior interfacial bonding strength. It enables highly reliable sintered connections in environments such as inert atmospheres, providing a pressureless sintering solution for high-frequency and power electronic devices.
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Test Item
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Test Method
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Remarks
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| Appearance | Brownish paste | |
| Particle Size | ≤500 nm | |
| Solid Content | ≥85% | |
| Viscosity |
0.5 rpm ，70420±3000 cP 5 rpm ，29100±300 cP |
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| Thixotropic Index | 2.2±0.2 | |
| Application Process | Soldering application / Printing | |
| Pot Life | 25℃/4h |
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| Storage Condition | <-10 ℃ | |
| Shelf Life | 6 months | |
| Resistivity | ≤ 10 μΩ.cm | |
| Thermal Conductivity | ≥150 W/mK |
• High thermal conductivity, up to 150 W/(m·K).
• High electrical conductivity, with resistivity ≤10 μΩ·cm.
• High shear strength, reaching over 30 MPa.
• Good process compatibility, suitable for dispensing/printing processes.
