QLDTF7021 is a copper foil with sintering film suitable on die top sintering.It offers excellent electrical conductivity,thermal performance,and high-reliability.It can achieve highly reliable sintering connections on gold,silver,and copper substrates with a sintering pressure as low as15 MPa,silver/copper sintering on the top of high-power devlces.
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Indicators
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Performance
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Remarks
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size
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customizable
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Copperfoilthickness
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50-100μm(customizable)
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Silverfilmthickness
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50-100μm(customizable)
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Copperfoilpurity
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99.993%
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Silverfilmsolidcontent
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>99%
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Dispensingornot
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Optional/Dispensingdiameter(ifselected)
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Storagecondition
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Roomtemperature,nitrogen
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Storagelife
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3months
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·Suitable for copper wire bonding on die top.
·Perfect edge condition:No black edges or burrs on the copper foil.
·Dense and uniform sintering structure.
•High shear strength,with shear strength exceeding 60 MPa.
·High thermal conductivity,with thermal conductivity over 200 W/mK.
