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Cu Paste for Pressure Sintering

Cu Paste for Pressure Sintering

QLCu2112 is a nano-copper paste suitable for pressure sintering processes.It utilizes a self-developed paste formulation with excellent antioxidant capacity.It can be used in vacuum,nitrogen,and for micacid atmospheres,providing a high-reliability packaging solution for high-power devices.

Basic Parameters

Indicators
Performance
Remarks
Metalcontent
>80%
AccordingtoTGresults
Particlesize
≤1000nm
 
Sinteringtemperature
≥250℃
 
Sinteringpressure
10-20MPa
 
Sinteringtime
5min
 
Halogencontent
Zerohalogen
 
Sinteringatmosphere
Vacuum,inertatmosphere,formicacidatmosphere
 
Sinteredsurface
Cu、Ag、Au
 
Workinglife
≥8h
 
Storagecondition
≤-20℃
 
Shelflife
6months
 

产品性能

Model
ThermalConductivity
(W/mK)
ElectricalResistivity
(mΩ.cm)
Coefficientof
ThermalExpansion
(ppm/K)
ShearStrength
(MPa)
QLCu2112
>200
<0.015
17.2
>40
 
AdvantagesofQLCu2112

·The porosity of the sintered structure is as low as 7%-9%.

·Applicable to Au,Ag,Cu surfaces.The shear strength can be greater than 60 MPa with Ag surface.
·High electrical and thermal conductivity,longer lifespan,and higher reliability.