·Compatible with 6-inchand 8-inch waferbonding,smallfootprint
·Placement accuracy≤±10μm
·UPH:1100 pcs(standard chips for Ag paste pre-sintering)
·Universal module interface,quick assembly/disassembly,flexible matching
·Electromechanicalintegration and modular design,configurable modules according to needs
· EtherCat bus control,simple wiring/information exchange
·Equipped with vision calibration function and excellent motion repeatability and stability
·Applicable products:a variety of chips,AMB materials
